Device and method for pre-aligning TSV (Through Silicon Via) silicon chip

The invention relates to a device and a method for pre-aligning a TSV (Through Silicon Via) silicon chip. The device comprises a light source, an image sensor, a first device for rotating and lifting the TSV silicon chip, and a second device for translating the TSV silicon chip, wherein the image sensor is used for acquiring light signals reflected by the light source from the TSV silicon chip; the first device and the second device are used for performing centering and directional adjusting for the TSV silicon chip according the light signal. According to the device, the light signal acquired by the image sensor is utilized to compensate the eccentric magnitude and deviation magnitude of the TSV chip, so that the pre-aligning precision of the TSV silicon chip can be improved, and meanwhile, the working efficiency is increased, and automatic work can be performed.