TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS

TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS

Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound havi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIANG-TAI LU, HSI-KUEI CHENG, KUOIO LIU, JINGNG LIN, CHIENN LI, TZI-YI SHIEH, CHIH-HSIEN LIN, WENUN HUANG, RUEY-YUN SHIUE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.