Chemical mechanical polishing liquid and use method thereof

The present invention relates to applications of a chemical mechanical polishing liquid in silicon polishing, wherein the polishing liquid contains abrasive particles and an organic amine. The polishing liquid of the present invention has characteristics of high silicon removal rate, silicon wafer s...

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Bibliographische Detailangaben
Hauptverfasser:	JING JIANFEN, DAI CHENGLONG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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Beschreibung
Zusammenfassung:	The present invention relates to applications of a chemical mechanical polishing liquid in silicon polishing, wherein the polishing liquid contains abrasive particles and an organic amine. The polishing liquid of the present invention has characteristics of high silicon removal rate, silicon wafer surface hydrophilicity improving, easy reduction of adsorption of abrasive particles, and mist degree reducing.