PATTERN FORMING METHOD, PATTERN PRINTING METHOD, PATTERN FORMING SYSTEM AND PATTERN PRINTING SYSTEM

The present invention provides a pattern forming technique, wherein a layer of a desired pattern can be formed only with little coating liquid, and a pattern printing technique, by which a pattern can be printed with the pattern-forming technique in low cost. Pattern forming method comprising: a coa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUICHI MIKIO, KAWAGOE MASAFUMI, UENO HIROYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides a pattern forming technique, wherein a layer of a desired pattern can be formed only with little coating liquid, and a pattern printing technique, by which a pattern can be printed with the pattern-forming technique in low cost. Pattern forming method comprising: a coating step, wherein the surface of the plate with respect to the support-like movement of the nozzle toward the surface of the support to form a coating liquid ejection pattern layer; a first transfer step, wherein when the formed next pattern layer is formed with a transfer surface and the support surface of the convex portion of the version of the opposed state, so that the support and close contact with each other version, the primary transfer portion to the convex portion pattern layer; and a first peeling step, wherein the support of each other close is stripped from the plate, thereby forming one of a quadratic pattern layer among the support and plate.