Uncovering process for multi-layer ladder-like soft and hard combination plate

The invention discloses an uncovering process for a multi-layer ladder-like soft and hard combination plate. The uncovering process comprises the following steps that 1, a, electroplating, graph manufacturing and coverage film laminating are sequentially carried out on a two-sided soft plate; b, one-sided soft plates are bonded to the two sides of the two-sided soft plate, and electroplating and graph manufacturing are sequentially carried out on the one-sided soft plates; 2, a CO2 laser cutting machine is adopted for carrying out grooving on preset regions of the one-sided soft plates, and then coverage films laminated in the step 1 are uncovered and exposed; 3, coverage films are laminated on the regions, grooved, uncovered and exposed in the step 2, of the one-sided soft plates; 4, protecting films are stacked and laminated on the coverage films; 5, copper foil and prepreg are stacked and laminated on the one-sided soft plates, and then plate arranging is carried out, so that a hard plate is formed; 6, a UV machine is adopted for cutting a hard plate region corresponding to the protecting films, and the protecting films and the hard plate region corresponding to the protecting films are uncovered to expose the coverage films. The uncovering process can avoid the layering defect and the base material residual defect in the glue overflowing and uncovering processes.