Signal processing module and manufacturing method thereof

The embodiment of the invention provides a manufacturing method of a signal processing module. According to the manufacturing method, all functional bare chips and electronic components are selected, and all the functional bare chips comprise all functional bare chips forming a signal processing mod...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG XIAOHU, ZHAN LIANYANG, YAN JUN, JIANG XIAOHUA, WANG LIEYANG, PU GUANGMING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The embodiment of the invention provides a manufacturing method of a signal processing module. According to the manufacturing method, all functional bare chips and electronic components are selected, and all the functional bare chips comprise all functional bare chips forming a signal processing module circuit; a high-rigidity PCB substrate is manufactured; all the functional bare chips and all the electronic components are bound to the high-rigidity PCB substrate to form a PCB circuit; a lead frame is obtained through integration to be connected to the PCB circuit to be encapsulated, so that the signal processing module is formed. Accordingly, the invention further provides the signal processing module manufactured through the method. The signal processing module is small in occupied space region and high in stability.