METHODS AND APPARATUS FOR APPLYING ADHESIVES IN PATTERNS TO AN ADVANCING SUBSTRATE

Methods and apparatuses (100) herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate (106). The fluid application apparatus may include a slot die applicator (102) and a substrate carrier (104). The substrate carrier (104) may include one or more pattern elements (122) and may be adapted to advance the substrate (106) past the slot die applicator (102) as the slot die applicator (102) discharges adhesive onto the substrate (106). In operation, the substrate (106) is disposed on the substrate carrier (104); the substrate carrier (104) advances the substrate (106) past the slot opening (114) of the slot die applicator (102). In turn, the substrate (106) is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate (106) is intermittently compressed, adhesive discharged from the slot die applicator (102) is applied onto the substrate (106) in an area having a shape substantially the same as a shape defined by the pattern surface (122).