Method for vacuum assisted underfilling of an electronic device

Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill (30) onto a substrate (12) proximate to at least one exterior edge (18, 20, 22, 24) of an electronic device (14) attached to the substrate (12). A space (28) between the electronic device (14) a...

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Bibliographische Detailangaben
Hauptverfasser:	BABIARZ ALEC J, ZHAO JIANGANG, QUINONES HORATIO, RATLEDGE THOMAS L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill (30) onto a substrate (12) proximate to at least one exterior edge (18, 20, 22, 24) of an electronic device (14) attached to the substrate (12). A space (28) between the electronic device (14) and the substrate (12) is evacuated through at least one gap (27) in the underfill (30). The method further includes heating the underfill (30) to cause the underfill (30) to flow into the space (28). Because a vacuum condition is supplied in the open portion of the space (28) before flow is initiated, the incidence of underfill voiding is lowered.