Flip chip-packaging heat dissipation structure and preparation method thereof

The invention discloses a flip chip-packaging heat dissipation structure and a preparation method thereof, which belong to the field of packaging heat dissipation structures. Arrayed pits are made on a flip chip-packaging plastic package, and the size and arraying of the pits can be autonomously set according to the heat dissipation requirement of packaging; metal posts are then made in the arrayed pits; finally, the plastic package is cut by a certain height by a method such as etching or laser drilling, so that the arrayed metal posts are exposed. Since the arrayed metal posts are planted in the plastic package of the heat dissipation structure, the junction-to-case thermal resistance of the plastic package is decreased, which is favorable for packaging heat dissipation. Not only do the exposed metal posts enlarge heat exchange surface area under the condition of forced air cooling, but also turbulent flow is formed between the metal posts, and thereby the metal posts are more beneficial to heat dissipation in comparison with the laminar flow mode of conventional packaging.