Flooring assembly with heat dissipation layer

A flooring assembly (100) for a compartment floor includes a panel (104) made up of a first skin (126), a second skin (128) positioned below the first skin, and a core (120) encapsulated within the panel between the first and second skins and peripheral closeouts (124). A heat dissipation layer (116...

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Bibliographische Detailangaben
Hauptverfasser:	DESING JAMES E, BIDDLE ANDREW J
Format:	Patent
Sprache:	eng
Schlagworte:	BODY DETAILS OR KINDS OF RAILWAY VEHICLES BUILDING BUILDING MATERIALS CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS PERFORMING OPERATIONS RAILWAYS ROOFS STRUCTURAL ELEMENTS TRANSPORTING WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	A flooring assembly (100) for a compartment floor includes a panel (104) made up of a first skin (126), a second skin (128) positioned below the first skin, and a core (120) encapsulated within the panel between the first and second skins and peripheral closeouts (124). A heat dissipation layer (116) is provided in the flooring assembly at or above the first skin.