Preparation method of epoxy resin composition and copper-clad plate prepared from epoxy resin composition
The invention relates to a preparation method of an epoxy resin composition and a copper-clad plate prepared from the epoxy resin composition. The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional...
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| creator | LI PEIDE XIAO BIHUA |
| description | The invention relates to a preparation method of an epoxy resin composition and a copper-clad plate prepared from the epoxy resin composition. The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional resin together in a weight ratio of (1 to 20) to (1 to 120) for later use; and (2) preparing the epoxy resin composition, namely (a) weighing raw materials according to a formula, (b) feeding epoxy resin and tetrabromobisphenol A into a reaction device, heating to 160-180 DEG C, performing addition reaction in the presence of a catalyst, preserving heat for reacting for 120-180 minutes at the temperature, cooling the temperature to 120-150 DEG C, and then adding the UV functional reagent prepared in the step (1) for reacting for 30-60 minutes, and (c) cooling a reaction system below 60 DEG C, adding a diluent, and stirring and mixing to obtain the epoxy resin composition. As a special UV functional reagent is utilized, the UV blocking function of the prepared copper-clad plate is approximately equivalent to 6% of that of the four-functional epoxy resin, and therefore, the production cost can be greatly reduced; after the prepared epoxy resin composition is cured with dicyandiamide, the glass transition temperature Tg can be 135 DEG C or more and the CTI reaches up to 225V. |
| format | Patent |
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The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional resin together in a weight ratio of (1 to 20) to (1 to 120) for later use; and (2) preparing the epoxy resin composition, namely (a) weighing raw materials according to a formula, (b) feeding epoxy resin and tetrabromobisphenol A into a reaction device, heating to 160-180 DEG C, performing addition reaction in the presence of a catalyst, preserving heat for reacting for 120-180 minutes at the temperature, cooling the temperature to 120-150 DEG C, and then adding the UV functional reagent prepared in the step (1) for reacting for 30-60 minutes, and (c) cooling a reaction system below 60 DEG C, adding a diluent, and stirring and mixing to obtain the epoxy resin composition. As a special UV functional reagent is utilized, the UV blocking function of the prepared copper-clad plate is approximately equivalent to 6% of that of the four-functional epoxy resin, and therefore, the production cost can be greatly reduced; after the prepared epoxy resin composition is cured with dicyandiamide, the glass transition temperature Tg can be 135 DEG C or more and the CTI reaches up to 225V.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150527&DB=EPODOC&CC=CN&NR=104650543A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150527&DB=EPODOC&CC=CN&NR=104650543A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI PEIDE</creatorcontrib><creatorcontrib>XIAO BIHUA</creatorcontrib><title>Preparation method of epoxy resin composition and copper-clad plate prepared from epoxy resin composition</title><description>The invention relates to a preparation method of an epoxy resin composition and a copper-clad plate prepared from the epoxy resin composition. The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional resin together in a weight ratio of (1 to 20) to (1 to 120) for later use; and (2) preparing the epoxy resin composition, namely (a) weighing raw materials according to a formula, (b) feeding epoxy resin and tetrabromobisphenol A into a reaction device, heating to 160-180 DEG C, performing addition reaction in the presence of a catalyst, preserving heat for reacting for 120-180 minutes at the temperature, cooling the temperature to 120-150 DEG C, and then adding the UV functional reagent prepared in the step (1) for reacting for 30-60 minutes, and (c) cooling a reaction system below 60 DEG C, adding a diluent, and stirring and mixing to obtain the epoxy resin composition. 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The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional resin together in a weight ratio of (1 to 20) to (1 to 120) for later use; and (2) preparing the epoxy resin composition, namely (a) weighing raw materials according to a formula, (b) feeding epoxy resin and tetrabromobisphenol A into a reaction device, heating to 160-180 DEG C, performing addition reaction in the presence of a catalyst, preserving heat for reacting for 120-180 minutes at the temperature, cooling the temperature to 120-150 DEG C, and then adding the UV functional reagent prepared in the step (1) for reacting for 30-60 minutes, and (c) cooling a reaction system below 60 DEG C, adding a diluent, and stirring and mixing to obtain the epoxy resin composition. As a special UV functional reagent is utilized, the UV blocking function of the prepared copper-clad plate is approximately equivalent to 6% of that of the four-functional epoxy resin, and therefore, the production cost can be greatly reduced; after the prepared epoxy resin composition is cured with dicyandiamide, the glass transition temperature Tg can be 135 DEG C or more and the CTI reaches up to 225V.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
| title | Preparation method of epoxy resin composition and copper-clad plate prepared from epoxy resin composition |
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