Preparation method of epoxy resin composition and copper-clad plate prepared from epoxy resin composition

The invention relates to a preparation method of an epoxy resin composition and a copper-clad plate prepared from the epoxy resin composition. The method comprises the following steps: (1) preparing a UV functional reagent, namely evenly mixing a UV blocking fluorescent brightener and UV functional resin together in a weight ratio of (1 to 20) to (1 to 120) for later use; and (2) preparing the epoxy resin composition, namely (a) weighing raw materials according to a formula, (b) feeding epoxy resin and tetrabromobisphenol A into a reaction device, heating to 160-180 DEG C, performing addition reaction in the presence of a catalyst, preserving heat for reacting for 120-180 minutes at the temperature, cooling the temperature to 120-150 DEG C, and then adding the UV functional reagent prepared in the step (1) for reacting for 30-60 minutes, and (c) cooling a reaction system below 60 DEG C, adding a diluent, and stirring and mixing to obtain the epoxy resin composition. As a special UV functional reagent is utilized, the UV blocking function of the prepared copper-clad plate is approximately equivalent to 6% of that of the four-functional epoxy resin, and therefore, the production cost can be greatly reduced; after the prepared epoxy resin composition is cured with dicyandiamide, the glass transition temperature Tg can be 135 DEG C or more and the CTI reaches up to 225V.