Connection method of aluminum target material as sputtering target material and aluminum alloy backboard

The invention relates to a connection method of an aluminum target material as a sputtering target material and an aluminum alloy backboard. The connection method comprises the following steps: processing a circular boss on the connection surface of the aluminum target material, and processing a cir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUN XIULIN, GAO YAN, WAN XIAOYONG, DONG TINGYI, WANG YUE, LUO JUNFENG, LIU SHUQIN, LIU XIAO, XU XUELI, ZENG HAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to a connection method of an aluminum target material as a sputtering target material and an aluminum alloy backboard. The connection method comprises the following steps: processing a circular boss on the connection surface of the aluminum target material, and processing a circular embedded groove which corresponds to the boss on the connection surface of the aluminum alloy backboard; embedding the boss of the aluminum target material into the embedded groove of the aluminum alloy backboard; sealing and welding the target material and the edge of the backboard by adopting vacuum electron beam welding; performing heat treatment on a target material assembly, wherein the heating temperature is 150 to 450 DEG C, and the temperature is kept for 0.5 to 2 hours; directly hot-pressing the target material assembly after heat treatment, wherein the intensity of pressure is 80 to 250 MPa, and the intensity of pressure is kept for 0.2 to 2 hours. According to the connection method, a sheath is not used, the target material and the backboard are sealed and welded directly by adopting vacuum electron beams, the target material and a backboard assembly after sealing and welding are connected by adopting a hot-pressing method, so that the heating temperature is low, the connection pressure is low, and the requirements on equipment are low, and a novel tooth-shaped design is adopted, so that the target material can fully fill into tooth-shaped gaps, and the bonding strength is increased.