Method for compensating copper thickness of PCB (printed circuit board)

The invention provides a method for compensating copper thickness of a PCB (printed circuit board). Forward and reverse pulse plating technology is adopted, so that the phenomenon that the edge of a copper surface of the PCB is high and the middle of the copper surface is low is effectively reduced....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	XIA TIANTIAN, GUO MIAOHUA, XIE YONGDE, YE HONGFA, ZHENG PING, HAN TAO, HUI XIAOPING
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The invention provides a method for compensating copper thickness of a PCB (printed circuit board). Forward and reverse pulse plating technology is adopted, so that the phenomenon that the edge of a copper surface of the PCB is high and the middle of the copper surface is low is effectively reduced. After copper reduction operation on the PCB for the first time, the PCB is turned upside down to be subjected to copper reduction, the defect of uneven copper reduction caused by time difference when the PCB enters acid etching liquid or micro etching liquid is effectively overcome. A milder micro etching liquid system is adopted and is organically combined with the acid etching technology, so that the processing efficiency on the copper thickness of the PCB is effectively improved.