Cooling device
The invention relates to a cooling device (26) for cooling an electronic component, in particular a power semiconductor, comprising a cooling body (14) which can be thermally coupled to the component, at least one sonotrode element (12) for generating ultrasonic waves having a predetermined waveleng...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a cooling device (26) for cooling an electronic component, in particular a power semiconductor, comprising a cooling body (14) which can be thermally coupled to the component, at least one sonotrode element (12) for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body (14), and a resonance tube (16) which is associated with the sonotrode element (12) and which is arranged between the sonotrode element (12) and the cooling body (14). According to the invention, a distance between the sonotrode element (12) and the cooling body (14) corresponds to an integral multiple of the quarter of the wavelength, such that a standing wave is formed between sonotrode element (12) and the cooling body (14). |
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