SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE AND PACKAGING STRUCTURE

A method for fabricating a semiconductor package is disclosed, which includes the steps of: providing a first substrate; disposing a second substrate on the first substrate through a plurality of supporting elements, wherein the second substrate has at least a cleaning hole penetrating therethrough;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG LUNG-YUAN, CHIANG CHENGIA, SHIH CHIA-KAI, HSU CHUI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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