SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE AND PACKAGING STRUCTURE

A method for fabricating a semiconductor package is disclosed, which includes the steps of: providing a first substrate; disposing a second substrate on the first substrate through a plurality of supporting elements, wherein the second substrate has at least a cleaning hole penetrating therethrough; and performing a cleaning process to clean space between the second substrate and the first substrate through the cleaning hole, thereby preventing a popcorn effect from occurring when the first substrate is heated and hence preventing delamination of the semiconductor package. Further, the cleaning hole facilitates to disperse thermal stresses so as to prevent warping of the first and second substrates during a chip-bonding or encapsulating process, thereby overcoming the conventional drawbacks of cracking of the supporting elements and a short circuit therebetween.