Apparatus and methods for handling workpieces of different sizes

Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate (52) having an outer perimeter (65), an opening (70) inside of the outer perimeter (65), and a gap (72) extending between the opening (70) and the outer perimeter (65). The lift plate (...

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Bibliographische Detailangaben
Hauptverfasser:	FAZIO JAMES P, FOOTE DAVID K, GETTY JAMES D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate (52) having an outer perimeter (65), an opening (70) inside of the outer perimeter (65), and a gap (72) extending between the opening (70) and the outer perimeter (65). The lift plate (52) includes annular rims (120) of different inner diameters and that are configured to respectively support the first and second workpieces (28, 30).