Method for fabricating silicone-containing copolymer molded article having hydrophilic surface and silicone hydrogel contact lens having hydrophilic surface

The present invention provides a method permitting the fabrication of a silicone containing copolymer molded article having a hydrophilic surface by means of the cast molding method and without employing a high-molecular-weight hydrophilic polymer even when employing a polypropylene mold. Provide is...

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1. Verfasser:	IMAFUKU SUGURU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON CONTACT LENSES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention provides a method permitting the fabrication of a silicone containing copolymer molded article having a hydrophilic surface by means of the cast molding method and without employing a high-molecular-weight hydrophilic polymer even when employing a polypropylene mold. Provide is a method for fabricating a silicone-containing copolymer molded article having a hydrophilic surface by polymerizing a monomer solution containing (a) a silicone monomer comprising a (meth)acryloyl group; (b) a hydrophilic monomer comprising a vinyl group; (c) a crosslinkable monomer; and (d) a polymerization initiator in a cavity of a mold having a hydrophobic cavity surface. The polymerization initiator has a 10-hour half-life temperature (T10) of 70 DEG C or higher and 100 DEG C or lower, and the polymerization is conducted by means of a step P1 of maintaining a temperature within a range of from the T10 of the polymerization initiator contained in the monomer solution to 35 DEG C below T1O for one hour or more; and a step P2 of maintaining a temperature higher than the T10 of the polymerization initiator contained in the monomer solution for one hour or more.