Laser processing device

This laser processing device is provided with: a laser oscillator that emits laser light; a processing head (4) that irradiates an article to be worked with laser light output by the laser oscillator; and a light path duct that has an optical system that guides the laser light from the laser oscilla...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KYOTO TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This laser processing device is provided with: a laser oscillator that emits laser light; a processing head (4) that irradiates an article to be worked with laser light output by the laser oscillator; and a light path duct that has an optical system that guides the laser light from the laser oscillator to the processing head (4). A plurality of operating modes, in which parameters are made different during processing of the article to be worked, are prepared for the laser processing device and the operating modes includes an energy-saving mode in which the output range for the laser light is set lower than that for other operating modes.