SUPPORT UNIT AND SUBSTRATE TREATING DEVICE INCLUDING THE SAME

SUPPORT UNIT AND SUBSTRATE TREATING DEVICE INCLUDING THE SAME

Provided is a method of manufacturing a support unit that supports a substrate. In an embodiment of the invention, the method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a ma...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WONHAENG LEE, KANGRAE HA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is a method of manufacturing a support unit that supports a substrate. In an embodiment of the invention, the method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.