Method for manufacturing conductive circuit on paper substrate

The invention belongs to the technical field of flexible electronic materials, and relates to a method for manufacturing a conductive circuit on a paper substrate, in particular to a method for drawing the conductive circuit on the paper substrate through handwriting. The method comprises specific processes as follows: cleaning, drying and surface modification of cellulose paper, copper ion adsorption, circuit pattern preforming, electroless copper plating and the like. A paper-substrate handwritten circuit pattern prepared with the method has the following advantages: (1), the circuit pattern can be prepared through pattern drawing; (2), the copper circuit pattern is prepared, and the production cost is greatly reduced; (3), the technological process is a fully-additive process, precious metal catalyst and activating agents are not used, on one hand, the production cost is reduced, and on the other hand, adverse influence of non-copper metal in the copper circuit on the service life of the circuit pattern is avoided; (4), the conductive performance of the copper circuit pattern is good, and the energy consumption is reduced. The paper-substrate handwritten circuit pattern can be widely used for industrial fields such as wearable electronic products, radio frequency tag antennas, flexible chips and the like.