Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof

The invention relates to a heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and a manufacturing method thereof. The heat-conduction PCB glue combination aluminum-based circuit board and the manufacturing method thereof are used for LED (light emitting diode) light source products. The heat-conduction PCB glue combination aluminum-based circuit board comprises an aluminum-based layer and three circuit layers including a circuit layer A, a circuit layer B and a circuit layer C sequentially from top to bottom; a first dielectric layer is arranged between the circuit layer A and the circuit layer B; a second dielectric layer is arranged between the circuit layer B and the circuit layer C; conductive glue is arranged between the circuit layer C and the aluminum-based layer; the model of the conductive glue is CBF-300; the thickness of the conductive glue is 19-25 micrometers; and each of the first dielectric layer and the second dielectric layer consists of prepreg. The heat-conduction PCB glue combination aluminum-based circuit board is high in heat dissipation property and high in technological environmental protection property; and complex circuits can be arranged on the circuit board.