Ceramic heater for semiconductor manufacturing device

The invention provides a ceramic heater capable of realizing uniform temperature distribution on the whole surface of a wafer-carrying surface. The ceramic heater (10) is provided with a circular-plate-shaped ceramic substrate (1) and a cylindrical support body (3) connected to backside (1b) at an opposite side of the wafer-carrying surface (1a) of the ceramic substrate (1), a resistor heating body is embedded at the inner part of the ceramic substrate, the cylindrical support body is respectively connected to the inner circumference and the outer circumference of a connecting area (S1) in a concentric circle manner at the annular connecting area (S1) formed by the connection of the backside (1b) and the support body (3), and an annular inner side area (S2) and an outer side area (S3) whose areas are the same as the area of the connecting area (S1) form a whole annular area. The value of the area of the whole annular area divided by the heating amount of one portion of the resistor heating body (2) above the annular area is greater than the value of the area of the whole annular area detracted by the backside (1b) divided by the heating amount of other portions of the resistor heating body (2) except the portion of the resistor heating body (2).