Bond pad structure

The invention relates to a bond pad structure. The bond pad structure comprises a pad metal layer, a top metal layer and a bottom metal layer which are sequentially arranged from top to bottom, wherein areas of the pad metal layer, the top metal layer and the bottom metal layer are gradually increased; the pad metal layer, the top metal layer and the bottom metal layer adopt annular structures; besides, the areas of the pad metal layer, the top metal layer and the bottom metal layer are gradually increased, and a stress release channel is formed in the middle, so that the stress produced during wire bond on a bond pad is absorbed and eliminated, damage to a solid bond pad layer as well as a lamination of a metal interconnection layer and a dielectric layer which are located below the solid bond pad layer due to the fact that the stress is transmitted downwards is prevented, and defects in the prior art are overcome.