Bonding pad structure

The invention relates to a bonding pad structure which comprises a bonding pad, a conductive metal stacked structure and a connect line structure, wherein the bonding pad sequentially comprises a bonding pad metal layer, a top metal layer and a bottom metal layer from top to bottom; the conductive metal stacked structure at least comprises a first conductive metal layer on the same layer as the bonding pad metal layer, a second conductive metal layer on the same layer as the top metal layer and a third conductive metal layer on the same layer as the bottom metal layer from top to bottom; the connect line structure comprises a first connect line, a second connect line and a third connect line, the first connect line is connected with the bonding pad metal layer and the first conductive metal layer, the second connect line is connected with the top metal layer and the second conductive metal layer, and the third connect line is connected with the bottom metal layer and the third conductive metal layer. Three layers of connect lines are arranged between the bonding pad and the conductive metal stacked structure, and the problem that connect lines are likely to be broken in the prior art is solved.