Integrated circuit chip comprising electronic device and electronic system

Integrated circuit chip comprising electronic device and electronic system

An electronic device includes a substrate wafer made of many layers of an insulating material and including an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer further includes a metal plate that is integrated into the sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ALEXANDRE COULLOMB
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device includes a substrate wafer made of many layers of an insulating material and including an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer further includes a metal plate that is integrated into the substrate wafer and thermally coupled to the integrated circuit chip. The metal plate may have a thickness in excess of several layers of the substrate wafer. The metal plate may include a duct through which a thermally conductive fluid flows.