Module with stacked package components
The invention provides a module with stacked package components. The module configures at least one package component in a carrier with a groove, each package component includes a substrate and at least one crystalline grain arranged on the substrate, wherein the package components are arranged in t...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention provides a module with stacked package components. The module configures at least one package component in a carrier with a groove, each package component includes a substrate and at least one crystalline grain arranged on the substrate, wherein the package components are arranged in the carrier in a stacked manner, and are electrically connected with one another through metal contacts and metal wires arranged in the groove in the carrier, the package components are stacked in the carrier in order, and are connected with other external bases through the metal contacts arranged on the carrier, and the module with the stacked package components is formed. |
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