Cleaning method for removing binder on surface of bonding sheet obtained after silicon wafer back metal deposition process is conducted

The invention provides a cleaning method for removing a binder on the surface of a bonding sheet obtained after the silicon wafer back metal deposition process is conducted. The method includes the following steps that S1, an organic solvent is used for soaking a part; S2, an alkaline solution is us...

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Bibliographische Detailangaben

Hauptverfasser:	LIU XIAN, HE XIANHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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