Cleaning method for removing binder on surface of bonding sheet obtained after silicon wafer back metal deposition process is conducted

The invention provides a cleaning method for removing a binder on the surface of a bonding sheet obtained after the silicon wafer back metal deposition process is conducted. The method includes the following steps that S1, an organic solvent is used for soaking a part; S2, an alkaline solution is used for soaking the part; S3, an acid solution is used for cleaning the part; S4, cleanout fluid is used for cleaning the part; S5, the part is dried. The cleaning method for removing the binder on the surface of the bonding sheet obtained after the silicon wafer back metal deposition process is conducted is easy to operate, low in time consumption, low in energy consumption, capable of guaranteeing that the binder is removed, ideal in cleaning effect and incapable of damaging the bonding sheet.