Substrate for dual-layer flexible wiring, manufacturing method thereof, dual-layer flexible wiring board, and manufacturing method thereof

The invention provides a substrate for dual-layer flexible wiring, manufacturing method thereof, dual-layer flexible wiring board, and manufacturing method thereof. The substrate has an excellent bending resistant property. The provided dual-layer flexible wiring substrate or dual-layer flexible wir...

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Bibliographische Detailangaben
Hauptverfasser:	KOKAMI CHOUSI, HATA HIROKI, TAKEYUKI HIROSHI, NOGUCHI MASASHI, NISHIYAMA YOSHIHIDE, SHIMAMURA FUYU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention provides a substrate for dual-layer flexible wiring, manufacturing method thereof, dual-layer flexible wiring board, and manufacturing method thereof. The substrate has an excellent bending resistant property. The provided dual-layer flexible wiring substrate or dual-layer flexible wiring board is prepared by arranging a nickel alloy containing base metal layer on a resin membrane substrate without using any adhesive and then arranging a metal layer, which comprises a copper layer, on the surface of the base metal layer, and is characterized in that the crystallization ratio of OR111 to OR001 is less than 7, the crystallization orientation degree of the copper layer (111) is 1.2 or more, in the bending performance experiments, which meet the requirements of JIS C-5016-1994, the difference (d[(200)/(111)]) of the crystallization orientation ratio [(200)/(111)] of the copper layer before and after the experiments is 0.03 or more.