SPRING SUPPORT PLATE, FRACTURE DEVICE AND DIVIDING METHOD

The invention relates to a spring support plate, a fracture device and a dividing method. Resin layers of a composite substrate can be fractured along a fracture line. One face of the composite substrate is provided with substrate coating resin layers which are orderly arranged longitudinally and tr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWATSUBO, YUMA, KURODA, NAOHIRO, TOMIMOTO, HIROYUKI, NAKATANI, IKUYOSHI, TAKEDA, MASAKAZU, MURAKAMI, KENJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to a spring support plate, a fracture device and a dividing method. Resin layers of a composite substrate can be fractured along a fracture line. One face of the composite substrate is provided with substrate coating resin layers which are orderly arranged longitudinally and transversely so as to form multiple functional areas, and parts of the substrate are fractured at advance. Structural bodies (14) protruding from the functional areas are arranged on the upper surface of the composite substrate (10). Grid-shaped areas which are the same as the lines of the composite substrate (10) in separation distance are distributed on the spring support plate (40). Centers of the areas comprise protection holes (41) larger than the functional areas. When the resin layers of the composite substrate (10) are fractured, the structural bodies (14) of the functional areas are aligned to the protection holes (41) so as to dispose the composite substrate on the spring support plate (40). Then, extension bars are pressed from upper parts and the lower parts. In this way, the resin layers (12) can be fractured without damage to the functional areas (13).