Elastic support plate, breaking apparatus and dividing method

The invention relates to an elastic support plate, a breaking apparatus, and a dividing method. The invention aims to break the resin layer of a composite substrate along the breaking lines; wherein the composite substrate is obtained by coating a resin layer on a substrate with a plurality of funct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWATSUBO, YUMA, TOMIMOTO, HIROYUKI, NAKATANI, IKUYOSHI, TAKEDA, MASAKAZU, MURAKAMI, KENJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to an elastic support plate, a breaking apparatus, and a dividing method. The invention aims to break the resin layer of a composite substrate along the breaking lines; wherein the composite substrate is obtained by coating a resin layer on a substrate with a plurality of functional areas which are neatly arranged in the vertical and horizontal directions, and part of the substrate is broken down in advance. A composite substrate (10) is arranged on an elastic support plate (40). The elastic support plate (40) is enclosed by a frame-shaped part (42) which is slightly larger than the composite substrate. Through setting a frame-shaped part (42), the outermost chip can be pressed down by the frame-shaped part (42) as other chips, when an extension rod (32) descends, so as to deform the elastic support plate (40) to break the elastic support plate.