Device and method for ultrathin and flexible electronic device transfer and application of device

The invention discloses a device for electronic device transfer. The device comprises an upper electrode layer, a lower electrode layer, a viscous layer and an electrical active layer, wherein the upper electrode layer and the lower electrode layer are arranged oppositely in a spaced mode, an electric field can be generated between the upper electrode layer and the lower electrode layer after electrification, the viscous layer is fixedly connected to the lower surface of the lower electrode layer, the electrical active layer is arranged between the upper electrode layer and the lower electrode layer and can be squeezed to deform longitudinally or horizontally under the action of the electric field generated between the two electrode layers after electrification, the deformation of the electrical active layer drives the electrode layers and the viscous layer to deform so that shearing force and/or concave-convex ejecting force can be generated, and then the electrode layers and the viscous layer are debonded to be placed on a receptor substrate. The invention further discloses a method for electronic device transfer by means of the device and the application of the device. The method and device can be used for active placing of electronic devices. The device is simple in structure, quick and reliable in use, easy to control and the like. The method and device can be used for transfer of ordinary ultrathin and flexible electronic devices in various specifications as well as transfer of large-area array micro-electronic devices/structures.