Fluorosilicone mold release composition

Disclosed is a fluorosilicone mold release composition, comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is;...

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Bibliographische Detailangaben
Hauptverfasser: HUPFIELD PETER C, MASUTANI TETSUYA, ITAMI YASUO, MITSUHASHI HISASHI, KLEYER DON LEE
Format: Patent
Sprache:eng
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Zusammenfassung:Disclosed is a fluorosilicone mold release composition, comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf-X-, or Z-Y- in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).