Packaging structure and production method thereof

Disclosed are a packaging structure and a production method thereof. The packaging structure comprises a substrate, a cover, an electricity-conductive pattern and a sensing component. The cover is arranged on the substrate. An accommodating space is defined by the cover and the substrate. The electr...

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Bibliographische Detailangaben
Hauptverfasser:	LAI LVMING, HUANG JINGHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed are a packaging structure and a production method thereof. The packaging structure comprises a substrate, a cover, an electricity-conductive pattern and a sensing component. The cover is arranged on the substrate. An accommodating space is defined by the cover and the substrate. The electricity-conductive pattern comprises an electricity-conductive circuit, is arranged on one inner surface, exposed by the accommodating space, of the cover and is electrically connected to the substrate. The sensing component is arranged on the inner surface of the cover and is electrically connected to the electricity-conductive circuit.