Rolled copper foil

The invention relates to manufacturing methods of rolled copper foil, a copper-plated laminate plate using the roller copper foil, a printed wiring board, an electronic device and a circuit connecting member, and the circuit connecting member. The invention provides the rolled copper foil, copper-plated laminate plate and printed wiring board having excellent etching performance, bending performance, sealing performance with resin, and transparency of resin after the copper foiled being removed by means of etching. The rolled copper foil comprises 99.9% or above copper, and has plating layer formed on a single face or both faces. A skewness (Rsk) of the plating layer in the rolled right angle direction of the roller copper foil is set to be -0.35 to 0.53. The plating layers of the rolled copper foil are made to fit two faces of a polyimide resin film and then the rolled copper foil is removed by means of etching. And a user can use a CCD camera to photograph a printed item through the polyimide resin film. By this time, the Sv defined by Sv=(delta b*0.1)/(T1-T2) becomes above 3.0