Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof

The invention discloses a lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and an integration method thereof. The integrated circuit consists of a film ceramic substrate, film conduction bands, film stop bands, a film capacitor, a film inductor, chip components, semiconductor naked chips and a tube cape, wherein through holes are formed between the front side and the bottom side of the film ceramic substrate; the film conduction bands, the film stop bands, the film capacitor and the film inductors are integrated on the front side of the film ceramic substrate; the bottom side of the film ceramic substrate is protected by using an insulating medium film; the bottom side of the film ceramic substrate is a ball foot type external connecting end; the tube cap is mounted on the front side of the film ceramic substrate in an adhesion manner; positively mounted semiconductor naked chips are connected with the film stop bands through bonding wires; inversely mounted semiconductor naked chips are welded with metal ball feet through ball feet; a metal layer is arranged on the outer layer of the tube cap; a ceramic coating layer is arranged on the inner wall of the tube cap. The integration method comprises the following steps: preparing materials, forming holes, washing, forming a graphic network, welding, assembling, bonding, capping, and the like. A device adopting the lead-less ball foot surface adhesion type microwave film hybrid integrated circuit is wide in application and is particularly applicable to the field of small-size facility systems.