PCB ( printed circuit board) back-drilled cover plate and manufacturing method thereof

The invention discloses a PCB (printed circuit board) back-drilled cover plate and a manufacturing method thereof. The manufacturing method comprises the following steps: phenolic resin is impregnated on paper and then is baked into a prepreg; the single manufactured prepreg or multiple attached prepregs are attached to an aluminum foil in a pressed mode to obtain a phenolic-aldehyde cover plate with a single surface coated with the aluminum foil. The phenolic resin, the paper and the aluminum foil are compounded to form the phenolic-aldehyde cover plate with the single surface coated with the aluminum foil, a phenolic resin insulation dielectric layer formed by the phenolic resin and the paper replaces an epoxy resin glass-fiber compound insulation dielectric layer high in cost, the cost is greatly reduced, and meanwhile, the cover plate has the functions of easiness in drilling, good positioning effect and reduction of abrasion of a drill point. Besides, the aluminum foil replaces a copper foil high in cost, the cost can be further reduced substantially, and meanwhile, the cover plate has the advantages that a metal conducting layer is thin, thickness tolerance is small, the cover plate can be attached to a PCB well, and the depth control precision of drilling is good.