Design method for protection between upper layer and lower layer of blind buried hole circuit board

The invention provides a design method for protection between an upper layer and a lower layer of a blind buried hole circuit board. First type of holes are formed in a current layer of the blind buried hole circuit board and comprise blind holes or buried holes or through holes. The other layers ar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG ZHENYUN, PAN WEI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides a design method for protection between an upper layer and a lower layer of a blind buried hole circuit board. First type of holes are formed in a current layer of the blind buried hole circuit board and comprise blind holes or buried holes or through holes. The other layers are provided with signal lines or ground holes, and the signal lines or the ground holes are not overlapped with the first type of holes of the current layer. The design method for protection between the upper layer and the lower layer of the blind buried hole circuit board carries out protection between the upper layer and the lower layer on blind buried holes needing to be protected, so that the circuit board is more reasonable in design. The design time of a designer is saved, working efficiency is improved, and research and development cost is lowered; automatic detection is carried out on the blind buried holes needing protection, protection is carried out through an automatic avoiding mode, and influences on the performance of the circuit board due to negligence of the designer are avoided.