Method for manufacturing chip on board LED substrate and SMD LED substrate

A method for manufacturing a chip on board LED substrate (100) and an SMD LED substrate (108) is characterized in that the chip on board LED substrate (100) and the SMD LED substrate (108) each comprise a fine patterned thick film substrate body. The method comprises the following steps that glass-based dielectric layers (103 and 111) are formed on metal plates (101 and 109), the glass-based dielectric layers (103 and 111) are over-burnt, the dielectric layers (103 and 111) are coated with metal conducting layers (104 and 113), the metal conducting layers (104 and 113) are dried, glass and metal layers (103, 104, 111 and 113) are over-burnt to generate thick films, and an LED chip (105) is placed in a concave position of a circuit of a chip on board or LEDs (114) are packaged and placed on the circuit, wherein the method allows hardening of the thick films and combination of the thick films and the substrates (100 and 108).