Flexible circuit board and manufacturing method thereof

A flexible circuit board includes a covering film, a conductive circuit pattern and a first dielectric layer which are adhered in sequence, wherein the covering film has at least one opening that penetrates through the covering film, part of the conductive circuit pattern is exposed from the opening...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE MINGZHAN, HU XIANQIN, LUO JIAN, WANG SHAOHUA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!