Flexible circuit board and manufacturing method thereof

A flexible circuit board includes a covering film, a conductive circuit pattern and a first dielectric layer which are adhered in sequence, wherein the covering film has at least one opening that penetrates through the covering film, part of the conductive circuit pattern is exposed from the opening...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HE MINGZHAN, HU XIANQIN, LUO JIAN, WANG SHAOHUA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A flexible circuit board includes a covering film, a conductive circuit pattern and a first dielectric layer which are adhered in sequence, wherein the covering film has at least one opening that penetrates through the covering film, part of the conductive circuit pattern is exposed from the opening, the conductive circuit pattern exposed from the opening forms a bonding pad, a low temperature solder paste layer is formed on the bonding pad, an electronic component is welded to the low temperature solder paste layer and is electrically connected with the bonding pad through the low temperature solder paste layer, and the material of the first dielectric layer is polyethylene naphthalate. The invention also relates to a manufacturing method of the flexible circuit board.