Hole filling judgment method and device for blind holes of circuit board

The invention discloses a hold filling judgment method for blind holes of a circuit board. The method comprises the steps that a blind hole distribution picture of the circuit board needing hole filling judgment is obtained, wherein the blind hole distribution picture comprises N blind holes, and N is larger than or equal to 2; the blind hole distribution picture is divided into M judgment areas and M is larger than or equal to 1; the total area of the blind holes in each judgment area is calculated and the maximum value of the total area of the blind holes of the M judgment areas is selected; the maximum value is compared with a standard value, if the maximum value is larger than the standard value, it is determined that the blind holes in the circuit board need to be filled before laminating and otherwise, the blind holes in the circuit board do not need to be filled before laminating. The invention further discloses a hole filling judgment device for the blind holes of the circuit board. By means of the hole filling judgment method and device, whether the blind holes in the circuit board need to be filled before laminating can be quickly and accurately judged and accordingly the production quality and the efficiency of the circuit board with the blind holes are improved and the cost is reduced.