Line substrate and packaging structure

The invention discloses a line substrate and a packaging structure. The line substrate comprises a formed material that comprises a chip side surface and a welding ball side surface, wherein the chip side surface is opposite to the welding ball side surface. The line substrate further comprises a first conducting block that is embedded in the formed material. The first conducting block is provided with a first amount of first chip welding pad surfaces and a second amount of first welding ball side welding pad surfaces that are respectively exposed from the chip side surface and the welding ball side surface. The width of a cross section of the first conducting block in the formed material is greater than the first width of the first chip side welding pad surface and the second width of the first welding ball side welding pad surface.