Circuit board and manufacturing method thereof

The invention relates to a circuit board. The circuit board comprises a base material layer, a conductive circuit pattern and a protection layer which are sequentially arranged. The protection layer is formed by printing and solidifying printing ink. The printing ink comprises alicyclic epoxy resin,...

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Bibliographische Detailangaben
Hauptverfasser:	HE MINGZHAN, WANG ZHITIAN, HU XIANQIN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention relates to a circuit board. The circuit board comprises a base material layer, a conductive circuit pattern and a protection layer which are sequentially arranged. The protection layer is formed by printing and solidifying printing ink. The printing ink comprises alicyclic epoxy resin, a phenoxy resin solution, a solvent, a hardener and a defoaming agent. The invention further relates to a manufacturing method of the circuit board.