Optoelectronic module and method for producing an optoelectronic module

An optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216) has at least one semiconductor chip (104) for emitting electromagnetic radiation (118). The semiconductor chip (104) has a layer having a first conductivity (120), in particular a p-conductivity, a layer having a second conductivity (124), in particular an n-conductivity, a radiation surface (108) and a contact surface (106) which lies opposite the radiation surface (108). A contact (110, 117) is attached to the radiation surface (108). A frame (103) made of a potting compound (102) laterally encloses the semiconductor chip (104) in at least some regions such that the radiation surface (108) and the contact surface (106) are substantially free of the potting compound (102). A first contact structure (114) is arranged in at least some regions on the frame (103) and in at least some regions on the contact surface (106) and can be used for electrically contacting the layer having a first conductivity (120). A second contact structure (116, 138) is arranged in at least some regions on the frame (103) and in at least some regions on the contact (110, 117) of the radiation surface (108) and can be used for electrically contacting the layer having a second conductivity (124).