Manufacturing method of circuit board with blind holes

The invention discloses a manufacturing method of a circuit board with blind holes. The manufacturing method comprises the following steps: comparing the area of the blind holes in a circuit board to be manufactured with a standard value and determining whether the blind holes in the circuit board n...

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Bibliographische Detailangaben
Hauptverfasser: KUANG LIANGFA, LI KONG, REN DAIXUE, LI CHAOMOU, ZHANG LIANGCHANG, JIANG JIEMENG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention discloses a manufacturing method of a circuit board with blind holes. The manufacturing method comprises the following steps: comparing the area of the blind holes in a circuit board to be manufactured with a standard value and determining whether the blind holes in the circuit board need to be packed before lamination, wherein the circuit board comprises a first core veneer and a second core veneer, and at least one blind hole is formed in the first core veneer, while at least one other blind hole is formed in the second core veneer; if the blind holes need to be packed before the lamination, fabricating the first core veneer and drilling holes in the first core veneer; fabricating the second core veneer and drilling holes in the second core veneer; packing the holes in the first core veneer and the holes in the second core veneer; and laminating the first core veneer and the second core veneer by use of a prepreg, thereby obtaining the circuit board with the blind holes. According to the manufacturing method of the circuit board with the blind holes, whether the blind holes in the circuit board need to be packed before the lamination can be judged quickly and accurately, and therefore, the production quality and the production efficiency of the circuit board with the blind holes can be improved, and the cost can be reduced.