Power module capable of adopting diamond-like carbon film and aluminum substrate

The invention discloses a power module (comprising an IGBT, an MOSFET, a diode and other power modules) capable of adopting a diamond-like carbon film and an aluminum substrate. The power module structurally comprises silica gel (1), a metal electrode (2), the aluminum substrate (3), the diamond-like carbon film (4), a copper film (5), a soldering paste (6), a power chip (7) and an aluminum wire (8). The power module is suitable for the MOSFET, the IGBT, the diode and other power modules. The diamond-like carbon film (DLC) (4) and the aluminum substrate (3) have the advantages of being stable in material, good in insulativity, high in thermal conductivity and the like, the thermal resistance and packaging cost of the module are greatly reduced, and traditional DBC packaging can be replaced.