Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore

The present invention relates to the use of at least one oxidant, selected from peracids, in compositions for the processing of semiconductor wafers, in particular for t he cleaning and chemical mechanical polishing of semiconductor wafers. The present invention also relates to the use of a composit...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ALESSIO ROCCO, DOBSON STEVE, BOSSE JUERGEN, BELT HEINZ-JOACHIM
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SKI WAXES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to the use of at least one oxidant, selected from peracids, in compositions for the processing of semiconductor wafers, in particular for t he cleaning and chemical mechanical polishing of semiconductor wafers. The present invention also relates to the use of a composition and composition therefore. The use of the oxidants of the invention leads to a good efficacy while limiting/avoiding the corrosion of the substrate.